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open cavity plastic
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CORWIL | Welcome to CORWIL
Corwil Technology Corporation - Quality IC Assembly Services.
package
cob
wafer
bga
mcm
lcc
mil-spec
soic
iso-9002
plastic assembly
prototype assembly
wafer dicing
chip-on-board
ic assembly
ceramic packages
5005
multi-chip modules
quad flatpacks
cerdips
jlcc
open cavity plastic
sidebraze
cerquads
dscc suitability letter
fine pitch bonding
heat sink studs
method 5004
mil-std-883 certified
pin-down configurations
pin-up configurations
qml listed
www.corwil.com - 2009-02-12
Majelac Technologies - IC Assembly and Packaging Services
Majelac Technologies, Superior IC assembly services, dicing service, reballing, quick turn packaging
packaging
package
wafer
bga
lcc
flip chip
soic
plastic assembly
prototype assembly
reballing
semiconductor packaging
IC packaging
wafer dicing
bga repair
BGA reballing
IC Assembly
semiconductor assembly
ceramic packages
electromigration
quad flatpacks
pbga
cerdips
jlcc
open cavity plastic
sidebraze
electro migration packaging
electro migration testing
fine-pitch bonding
quick-turn prototypes
www.majelac.com - 2009-02-04
jlcc
integrated
lcc
fmeca
fmea
life cycle cost
ic assembly
ceramic packages
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